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featured products

  • UWB LNA
    Our company provides a comprehensive range of Ultra-Wideband Low Noise Amplifier (UWB LNA) products, with frequency coverage spanning DC-18GHz, DC-40GHz, 0.5-6GHz, 0.8-18GHz, and 2-18GHz.The series UWB LNAs boast advantages such as high in-band flatness and low noise characteristics.
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  • Switches
    Our company provides a comprehensive line of Ultra-Wideband switch(UWB Switch) products,with frequencies covering DC-50GHz. This series of UWB Switch has the advantages of full positive voltage control, low insertion loss and high isolation characteristics.
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  • System-in-Package
    Through multi-physics co-simulation (thermal, electrical, electromagnetic, and mechanical) design methodology, we achieve high-density heterogeneous integration of compound semiconductor devices, silicon-based semiconductor devices, MEMS components, and passive elements with diversified material properties. This advanced System-in-Package (SiP) solution delivers high-performance, miniaturized, cost-effective, and heterogeneously integrated multi-functional microsystem packages.
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  • Microwave Module
    Hybrid Microwave Integration Technology By leveraging hybrid integration techniques, we synergistically combine multiple microwave components into fully functional modular subsystems. This approach effectively marries the benefits of Monolithic Microwave Integrated Circuits (MMIC) with discrete components, delivering optimized performance in high-frequency regimes (microwave to millimeter-wave bands) through enhanced integration density, miniaturized form factors, and high dependability.
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UWB LNA
Our company provides a comprehensive range of Ultra-Wideband Low Noise Amplifier (UWB LNA) products, with frequency coverage spanning DC-18GHz, DC-40GHz, 0.5-6GHz, 0.8-18GHz, and 2-18GHz.The series UWB LNAs boast advantages such as high in-band flatness and low noise characteristics.
Learn More
Switches
Our company provides a comprehensive line of Ultra-Wideband switch(UWB Switch) products,with frequencies covering DC-50GHz. This series of UWB Switch has the advantages of full positive voltage control, low insertion loss and high isolation characteristics.
Learn More
System-in-Package
Through multi-physics co-simulation (thermal, electrical, electromagnetic, and mechanical) design methodology, we achieve high-density heterogeneous integration of compound semiconductor devices, silicon-based semiconductor devices, MEMS components, and passive elements with diversified material properties. This advanced System-in-Package (SiP) solution delivers high-performance, miniaturized, cost-effective, and heterogeneously integrated multi-functional microsystem packages.
Learn More
Microwave Module
Hybrid Microwave Integration Technology By leveraging hybrid integration techniques, we synergistically combine multiple microwave components into fully functional modular subsystems. This approach effectively marries the benefits of Monolithic Microwave Integrated Circuits (MMIC) with discrete components, delivering optimized performance in high-frequency regimes (microwave to millimeter-wave bands) through enhanced integration density, miniaturized form factors, and high dependability.
Learn More
About us

Tianfu Chip located in Cheng Du, China, has more than 11 years heritage in high frequency MMIC design and manufacturing. We focuses on two product lines: RF MMIC chips and RF SiPs.  Tianfu Chip is committed to advancing microwave technology, providing customized solutions to meet diverse industry needs. With a dedicated team of experts, it continues to push the boundaries of microwave engineering, driving progress in telecommunications and beyond.

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900
Standard products developed
11
years of MMICs development experience
108
various patents granted
  • Contact Us
  • Tel: +86 17358503757
  • Email: lvda@tianfuchip.com
  • Head Office: No.88 Tianchen Road, High-Tech Zone, Chengdu, Sichuan, China
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