About Us-TianfuChip: Focusing on RF/Microwave Chips and Microsystem solutions

TianfuChip:
Committed to providing customers with high-performance microwave and millimeter-wave products and solutions.

Company Overview:

TianfuChip, headquartered in Chengdu, China, is a premier leader in the design and development of high-performance RF chips and modules. With over 11 years of industry-leading expertise, we have established ourselves as a trusted partner for sophisticated RF solutions across the global aerospace, defense, and telecommunications markets.

Core Capabilities

We specialize in the full lifecycle of RF engineering—from intricate chip-level design to complex module integration. With 1,000+ off-the-shelf products development experience, we understand that unique projects often require unique specs. Our R&D team provides::

Die-level & Packaged Chip options (QFN, Ceramic, Hermetic).
SiP (System-in-Package) integration for miniaturization.
Strict Screening: Environmental stress screening (ESS) for military-grade reliability.

Backed by a 2,000㎡ high-spec ESD-protected, class 1000 cleanroom, our advanced Reliability Verification Center is equipped with over 80 sets of sophisticated test systems. Capabilities span :

Device Validation
Chip Co-Design
Wafer Testing & Storage
Product-Level Reliability Testing & Analysis
Board-Level Device Evaluation & Application Development

1000

Standard products developed

years of RF MMICs development experience

108

various patents granted

This infrastructure ensures our products meet the most rigorous
standards for performance, durability,
and application readiness.